JPH0519954Y2 - - Google Patents

Info

Publication number
JPH0519954Y2
JPH0519954Y2 JP1985128842U JP12884285U JPH0519954Y2 JP H0519954 Y2 JPH0519954 Y2 JP H0519954Y2 JP 1985128842 U JP1985128842 U JP 1985128842U JP 12884285 U JP12884285 U JP 12884285U JP H0519954 Y2 JPH0519954 Y2 JP H0519954Y2
Authority
JP
Japan
Prior art keywords
header
semiconductor chip
main surface
electrode
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1985128842U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6237928U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985128842U priority Critical patent/JPH0519954Y2/ja
Publication of JPS6237928U publication Critical patent/JPS6237928U/ja
Application granted granted Critical
Publication of JPH0519954Y2 publication Critical patent/JPH0519954Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1985128842U 1985-08-26 1985-08-26 Expired - Lifetime JPH0519954Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985128842U JPH0519954Y2 (en]) 1985-08-26 1985-08-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985128842U JPH0519954Y2 (en]) 1985-08-26 1985-08-26

Publications (2)

Publication Number Publication Date
JPS6237928U JPS6237928U (en]) 1987-03-06
JPH0519954Y2 true JPH0519954Y2 (en]) 1993-05-25

Family

ID=31024873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985128842U Expired - Lifetime JPH0519954Y2 (en]) 1985-08-26 1985-08-26

Country Status (1)

Country Link
JP (1) JPH0519954Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016105508A (ja) * 2016-02-29 2016-06-09 株式会社三社電機製作所 半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51123065A (en) * 1975-04-21 1976-10-27 Hitachi Ltd Semiconductor device
JPS5989427A (ja) * 1982-11-15 1984-05-23 Sanken Electric Co Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS6237928U (en]) 1987-03-06

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